变化四：新兴先进封测技术的兴起CoWoS先进封装可谓HBM的黄金搭档。随着全球对于高性能计算（HPC）及人工智能（AI）芯片需求的持续增长，也推动了对于台积电CoWoS（Chip on Wafer on Substrate）先进封装产能的需求暴涨，虽然台积电持续扩大产能，但依然难以满足市场需求，成为了限制HPC及AI芯片产能的另一关键瓶颈。这也使得部分客户考虑寻求台积电CoWoS以外的替代方案，其中就包括英特尔的EMIB-T先进封装技术。
Maciej Piętowski
。关于这个话题，同城约会提供了深入分析
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They still dominate an industry that is now estimated to be worth billions across the globe. But increasingly, South Korean entertainment is making a play for what analysts believe is a booming market. Now, artificial intelligence (AI) is poking its head round the corner, promising lower costs and more opportunities.